JESD22

Solid State Device Packaging Standards

JESD-22 is a series of uniform methods and procedures for evaluating the reliability of packaged solid state devices.  JESD-22 establishes the physical, electrical, mechanical, and environmental conditions under which these packaged devices are to be tested.

  • A100 – Cycled Temperature Humidity Bias Life Test
  • A101 – Steady-State Temperature-Humidity Bias Life Test
  • A102 – Accelerated Moisture Resistance – Unbiased Autoclave
  • A103 – High Temperature Storage life
  • A104 – Temperature Cycling
  • A105 – Power and Temperature Cycling
  • A106 – Thermal Shock
  • A107 – Salt Atmosphere
  • A108 – Temperature, Bias, and Operating Life
  • A110 – Highly Accelerated Temperature and Humidity Stress Test
  • A118 – Accelerated Moisture Resistance – Unbiased HAST
  • A119 – Low Temperature Storage Life
  • A121 – Measuring whisker Growth on Tin and Tin Alloy Surface Finishes
  • A122 – Power Cycling
  • B103 – Vibration, Variable Frequency
  • B104 – Mechanical Shock
  • B110 – Mechanical Shock – Component and Subassembly
  • B111 – Board Level Drop Test Method of Components for Handheld Electronic Products