MIL-STD-883

Microelectric Device Testing Procedures

MIL-STD-883 establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and training procedures; and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability suitable to the intended applications of those devices.  For the purpose of this standard, the term “devices” includes such items as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed.  This standard is intended to apply only to microelectronic devices.  

  • Test Method 1001 Barometric Pressure, reduced (altitude operation)
  • Test Method 1002 Immersion
  • Test Method 1003 Insulation Resistance
  • Test Method 1004.7 Moisture resistance
  • Test Method 1005.9 Steady state life
  • Test Method 1006 Intermittent life
  • Test Method 1007.1 Agree life
  • Test Method 1008.2 Stabilization bake
  • Test Method 1009.8 Salt atmosphere (corrosion)
  • Test Method 1010.8 Temperature cycling
  • Test Method 1011.9 Thermal shock
  • Test Method 1013 Dew point
  • Test Method 1015.10 Burn-in test
  • Test Method 1016.2 Life/reliability characterization tests
  • Test Method 2001.3 Constant Acceleration
  • Test Method 2002.5 Mechanical shock
  • Test Method 2005.2 Vibration fatigue
  • Test Method 2006.1 Vibration noise
  • Test Method 2007.3 Vibration, variable frequency
  • Test Method 2015.14 Resistance to solvents
  • Test Method 2026 Random vibration