Thermal Shock Testing – Temperature Cycling

Thermal shock testing also called temperature shock testing or temperature cycling exposes products to alternating low and high air temperatures to accelerate failures caused by repeated temperature variations during normal use conditions. The transition between temperature extremes occurs very rapidly during thermal shock testing, greater than 15 °C per minute. Alternatively, temperature cycle testing uses slower rates of change between high and low temperatures. The failure acceleration rate for thermal shock testing is determined by the Coffin-Manson equation as previously discussed in DES’s blog article Temperature Cycling Testing: Coffin-Manson Equation. Equipment with single or multiple chambers may be used to perform…

Lead Free Solder Reliability Issues and Test Methods

This article discusses the reliability challenges of switching over to lead-free solder and the test methods used to demonstrate reliability, written by Gary Delserro and published in Evaluation Engineering Magazine.  Click on the link to download the article in PDF, Lead Free Solder Reliability Issues & Test Methods. Environmentally friendly is a term rapidly invading the electronics industry. The electronic industry will be facing great challenges over the next few years as the solder used in electronic products is migrating toward lead-free.  This is being driven by mandates in Europe such as Waste Electrical and Electronic Equipment (WEEE) and Restrictions of…