A typical circuit board may contain hundreds of solder joints and many different types of components. There are many failure modes that can occur. Thus, it is essential to validate your product’s solder joint durability using Reliability Testing.
Lead-free solders have poorer wetting characteristics than tin-lead solders which increases the risk of solder defects. Higher process temperatures must be used to melt lead-free solder for longer durations to overcome these poorer wetting characteristics. These harsher process conditions may cause damage to the electronic components and reduce product reliability.
DES has wide-ranging knowledge and experience in the area of Lead Free and SnPb Solder Joint Reliability Testing.
Testing Methods Include:
- HALT or Rapid HALT
- Mechanical vibration and shock testing
- Temperature cycling, thermal shock, and humidity testing
- Typical guidelines used for testing are from IPC and JEDEC