JESD22
Solid State Device Packaging Standards
JESD-22 is a series of uniform methods and procedures for evaluating the reliability of packaged solid state devices. JESD-22 establishes the physical, electrical, mechanical, and environmental conditions under which these packaged devices are to be tested.
- A100 – Cycled Temperature Humidity Bias Life Test
- A101 – Steady-State Temperature-Humidity Bias Life Test
- A102 – Accelerated Moisture Resistance – Unbiased Autoclave
- A103 – High Temperature Storage life
- A104 – Temperature Cycling
- A105 – Power and Temperature Cycling
- A106 – Thermal Shock
- A107 – Salt Atmosphere
- A108 – Temperature, Bias, and Operating Life
- A110 – Highly Accelerated Temperature and Humidity Stress Test
- A118 – Accelerated Moisture Resistance – Unbiased HAST
- A119 – Low Temperature Storage Life
- A121 – Measuring whisker Growth on Tin and Tin Alloy Surface Finishes
- A122 – Power Cycling
- B103 – Vibration, Variable Frequency
- B104 – Mechanical Shock
- B110 – Mechanical Shock – Component and Subassembly
- B111 – Board Level Drop Test Method of Components for Handheld Electronic Products