Temperature cycling testing is another method of accelerated life testing for products that are exposed to temperature variations during use in normal operation. The temperature variations can be a result of self heating for products that are repeatedly turned on and off, or can be the result of cyclic environmental changes — such as temperature variations from day to night — or other causes.
These repeated temperature changes can result in thermal fatigue and lead to eventual failure after many thermal cycles. Accelerated life testing can be performed by cycling the product to high and low temperatures that exceed its normal use temperatures.
It should be noted that temperature cycling may also be referred to as thermal cycling or thermal shock testing. However, some test standards, such as MIL-STD-883, make the distinction between temperature cycling being performed as air to air testing and thermal shock being performed with the samples transferred between liquids. This article deals with testing performed using an air to air thermal cycle chamber.
Typical temperature cycling equipment consists of at least one hot chamber and one cold chamber. The test samples are automatically transferred between the two chambers by an elevator-type mechanism. It is also possible to perform temperature cycling in a single compartment chamber where the temperature is ramped between hot and cold. This generally produces a slower rate of temperature change compared to the two chamber method.
The acceleration factor resulting from the temperature cycle test is the ratio of the product life at normal operating conditions to the life at accelerated test conditions and is given by the Coffin-Manson equation:
AF = (ΔT test / ΔT use) m
AF = Acceleration Factor
ΔT test = Test temperature difference (°C)
ΔT use = Use temperature difference (°C)
m = Fatigue or Coffin-Manson exponent
As an example, assume a product that undergoes 5 daily temperature transitions from
20 °C to 60 °C (ΔT use = 40 °C) while it is normally being used. The following acceleration will occur if the product is temperature cycle tested using a high temperature of 100 °C and a low temperature of -20 °C (ΔT test = 120 °C), assuming a typical Coffin-Manson exponent of 3:
AF = (120 / 40)3 =27
Testing this product for 1000 temperature cycles using the accelerated conditions would therefore be equal to 15 years of life based on the stated use conditions.
(27 X 1000 cycles) / ((5 cycles per day) (365 days per year)) = 14.8 years
However, care must be taken when choosing the test conditions so that both the upper and lower temperatures used do not exceed the temperature limits of the product. Doing so can result in failure modes that would not occur during normal operating conditions.
The rate of change between the cold and hot temperatures should also be controlled. Some specifications require that the test specimen reaches the dwell temperature within a given time limit for each change in temperature.
The proper dwell time at temperature extreme must also be considered. In general, the time must be long enough to allow the part to equilibrate to the air temperature. Larger and heavier parts with a higher thermal mass will therefore need longer dwell times than lighter and smaller parts with less thermal mass.
It is also important not to remain at the dwell temperatures for too long of a time, as this can also result in invalid failure modes. An example of this would be solder creep failure in a circuit board that is soaked for too long of a time at a temperature too close to the melting point of the solder.
Knowing the correct value for the fatigue or Coffin-Manson exponent is also important, as small changes in this exponent can have larger changes in the acceleration factor. Exponents for many materials have been reported, and can be found in the literature or on the Internet. It is also possible to experimentally determine the fatigue exponent by performing multiple tests with different values of ΔT test.
Delserro Engineering Solutions, Inc. (DES) has many years of experience performing temperature cycle testing and can assist customers in setting up a test using the proper test conditions and correlating the results to time in the field.
So if you don’t know what test conditions you should use, what specification to choose, or how to correlate your test to field life, we can help you, because we are reliability testing experts!
18 thoughts on “Temperature Cycling Testing: Coffin-Manson Equation”
I just read your article titled “Temperature Cycling Testing: Coffin-Manson Equation”. I’m interested in knowing more about typical temperature ranges and cycles per day that a networking chassis would undergo. Also, I’m interested in knowing typical coffin-manson coefficients.
Typical temperature ranges for computers/telecom are 0 to 25C to +100C. Typical number of cycles per day is around 24. Typical assumed coefficients for solder joints are 2.5 – 2.65.
You say “typical assumed” coefficients, but where do these numbers actually originate from?
I understand that they are based on experimental data rather than “assumed”?
They are derived from experimental data.
Im interested to know experimentally how we can derive the exponent for Coffin Manson equation.
If there are different model set up ( eg : of different board thickness, dielectric material), does all will have different exponent figure as well?
You would have to develop a program testing samples to various temperature cycle ranges. Then use inverse power law to find exponent. The samples should be the same. Most samples need to be tested to failure. Different board thickness, dielectric material could yield different exponents.
Hi am I correct saying that this calculation can be used for a fixed temperature of say 25ºC for a period of 2 years.
No the coffin-manson equation is for temperature cycling only.
What can I use to work out fixed temperature of say 25ºC for a period of 2 years.
Use the Arrhenius relationship for constant temperature accelerated life testing. You can learn more at https://www.desolutions.com/blog/2013/08/constant-temperature-accelerated-life-testing-using-the-arrhenius-relationship/
how to calculate FIT from Temperature Cycling testing? please help advise, thanks
What would be the Coffin-Manson exponent for a glass-to-cast epoxy interface delamination?
Was wondering if you have a equivalency table on stress for -55/125 vs -65/150. Appreciate if you could share this info. Thanks!
Assume Tuse and exponent (m) are the same for both. Calculate acceleration factor AF1 using -55/125 (Test ΔT= 180), then calculate AF2 using -65/150 (Test ΔT= 215).
I was wondering if I can use the Coffin-Manson equation for building insulating materials? What would be the Coffin-Manson exponent?
I’m writing my thesis, and I’m about to run a thermal shock test for some car lighting panels. What ΔT use, and m exponent value should I use? It’s a normal panel, with some leds on it, inside the car cabin. I want to test the solder joints.
Thanks for your help beforehand.
It’s surprising to find on desolutions.com a resource so precious about equations.
We will note your page as a benchmark for Temperature Cycling Testing: Coffin-Manson Equation.
We also invite you to link and other web resources for equations
like equation-solver.org or https://en.wikipedia.org/wiki/Equation.
Thank you ang good luck!
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