What is the Difference Between Thermal Shock and Temperature Cycle Testing?

Our customers often ask, What is the Difference Between Thermal Shock and Temperature Cycle Testing?  Both types of tests expose products to cycles between hot and cold temperatures.  Both tests produce stresses caused by thermal expansion and contraction.  In many cases, components expand and contract differently.  This creates cumulative fatigue damage during each cyclic, which could result in a fatigue failure.

Thermal shock exposes devices to rapid temperature changes greater than 15°C/minute.  Temperature cycle testing uses a transition rate less than 15°C/minute and is usually between 1 to 10°C/minute from our experience. 

Continue reading What is the Difference Between Thermal Shock and Temperature Cycle Testing?

MIL-STD 810, Method 516, Shock Testing Procedure VI – Bench Handling

This is the final part of a series of blog posts concerning the MIL-STD 810 Shock Section, Method 516.  This blog was written with reference to MIL-STD-810G w/Change 1 dated 15 April 2014.  DES has the experience and expertise to run your MIL-STD-810 test.  For more information, please check out our DES shock testing services page and our other MIL-STD-810 shock testing blog articles:

MIL-STD 810, Method 516, Shock Testing Overview

MIL-STD 810, Method 516, Shock Testing Procedure I – Functional Shock

MIL-STD 810, Method 516, Shock Testing Procedure II – Transportation Shock

MIL-STD 810, Method 516, Shock Testing Procedure III – Fragility

MIL-STD 810, Method 516, Shock Testing Procedure IV – Transit Drop

MIL-STD 810, Method 516, Shock Testing Procedure V – Crash Hazard Shock

Continue reading MIL-STD 810, Method 516, Shock Testing Procedure VI – Bench Handling